Volume 46 No. 2 - Summer 2016
Volume 46 No. 1 - Spring 2016
Volume 45 No. 4 - Winter 2015
June 1, 2016
Annual meeting of the Chinese Academy of Engineering, Beijing
Continuation of Life as We Know It on the Planet – An Engineering Vision
October 4, 2015
51st National Academy of Engineering Annual Meeting
I am honored to welcome all our members, foreign members, special friends, and guests to this 51st annual meeting of the National Academy of Engineering. I offer my warmest welcome to our newly elected members and foreign members and assure you that this induction day will be one that you will remember. And a special welcome is extended to all our spouses who have put up with us so graciously and make our work at the Academy possible.
Transcript of NAE President C. D. Mote Jr.'s Introductory remarks at the PeaceTech Summit: Engineering Durable Peace.
In his address March 21 at a first-of-its-kind engineering leadership conference at Rice, NAE President Dan Mote urged engineering students to understand the difference between being a leader and being placed in a position of authority.
As Dan Mote begins a six-year term as NAE president, he shares a little bit about what brought him here and his future plans for the NAE.
Private support enhances our capacity to be a public voice for engineering.
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Full Biography
Professor Molly Shoichet
University of Toronto
Year Elected: 2016
For contributions to neural tissue engineering and design of polymers for cell and drug delivery.
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Full Biography
Professor Philip T. Krein
University of Illinois at Urbana-Champaign
Year Elected: 2016
For contributions to power electronics technology and education.
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Full Biography
Professor Alan Eli Willner
University of Southern California
Year Elected: 2016
For significant advances in high-capacity optical communication systems.
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Full Biography
Mr. Gary J. Klein
Wiss, Janney, Elstner Associates, Inc.
Year Elected: 2016
For investigations of national and international infrastructure and conveying knowledge from these investigations to the profession.
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Full Biography
Professor Peter Gumbsch
Karlsruhe Institute of Technology (KIT)
Year Elected: 2016
For multiscaled modelling techniques that improve fracture and deformation behavior of structural materials.
Amano, Hiroshi Nagoya University
Ambani, Dhirubhai Mukesh Reliance Industries Ltd.
Anderson, R. Kevin Brunswick Corporation - Mercury Marine Division
Anderson, E. Thomas University of Washington
Bao, Zhenan Stanford University
Battel, James Steven Battel Engineering, Inc.
Boneh, Dan Stanford University
Burland, Boscawen John Imperial College London
Busalacchi, J. Antonio University Corporation for Atmospheric Research
Carter, A. Emily Princeton University
Celia, A. Michael Princeton University
Chang, R. Frederick Southern Methodist University
Cherry, R. Simon University of California, Davis
Collins, Morton MCollins Ventures
Connelly, M. Thomas American Chemical Society
Cornuejols, Gerard Carnegie Mellon University
de Pablo, J. Juan The University of Chicago
Delp, L. Scott Stanford University
Detournay, Emmanuel University of Minnesota
Dimotakis, Emanuel Paul California Institute of Technology
Doherty, Francis Michael University of California, Santa Barbara
Doi, Masao Beihang University
Doyle, M. Fiona University of California, Berkeley
Ellison, James Adam Corning Incorporated
Fauske, K. Hans Fauske and Associates, LLC
Gellings, W. Clark Clark W. Gellings, P.E.
Greenberg, G. Albert Microsoft Corporation
Gumbsch, Peter Karlsruhe Institute of Technology (KIT)
Hatamian, Mehdi Broadcom Limited
Hipel, William Keith University of Waterloo
Ho, C. Teh ExxonMobil Research and Engineering Company
Hubbard, E. James University of Maryland
Jacobs, E. Paul Qualcomm Incorporated
Jain, K. Anil Michigan State University
Jiang, Lei Chinese Academy of Sciences
Joffe, Louis Basil Spiral Software, Ltd.
Johnson, S. David Columbia University
Johnson, M. Kristina Cube Hydro Partners
Kalender, A. Willi University of Erlangen-Nuremburg
Kim, S. Peter Stanford University
Klein, J. Gary Wiss, Janney, Elstner Associates, Inc.
Krein, T. Philip University of Illinois at Urbana-Champaign
Leiserson, E. Charles Massachusetts Institute of Technology
Lindsay, G. Bruce IBM Almaden Research Center
Liu, Yilu University of Tennessee and Oak Ridge National Lab
Magnusson, D. Jon Magnusson Klemencic Associates
Maidment, R. David The University of Texas
Maloney, Michael Pratt & Whitney
Michel, Bruno IBM Research, Zurich
Moorman, W. Charles Norfolk Southern Corporation
Oliver, Carl Warren Nanomechanics, Inc.
Oren, Shimon Shmuel University of California, Berkeley
Prabhakar, Arati U.S. Defense Advanced Research Projects Agency
Pui, Y. H. David University of Minnesota
Rawlings, B. James University of Wisconsin-Madison
Rebeiz, M. Gabriel University of California, San Diego
Reder, K. Wanda S&C Electric Company
Reis, Luis Rui University of Minho
Rodriguez, R. Rodolfo Advanced Animal Diagnostics
Rowe, Kerry R. Queen's University
Sachs, Michael Emanuel 1366 Technologies Inc.
Salamone, Beal Ann Rochal Industries, LLC
Santiesteban, Guadalupe Jose Exxon Research & Engineering Company
Scanlon, R. Bridget The University of Texas at Austin
Sedlak, L. David University of California, Berkeley
Shahidehpour, Mohammad Illinois Institute of Technology
Shoichet, Molly University of Toronto
Sinnett, K. Michael Boeing Commercial Airplane
Steigerwald, L. Robert Adirondack Power Processing, LLC
Steltzner, Dietrich Adam Jet Propulsion Laboratory
Stoica, Peter Uppsala University
Stokes, H. Grant Massachusetts Institute of Technology Lincoln Laboratory
Sullivan, D. Kathryn U.S. Department of Commerce
Sun, Yongkui Merck & Co., Inc.
Swartzel, Ray Kenneth North Carolina State University
Thakur, C. Ganesh University of Houston
Thomas, Kent L. Upstream Technology
Tikka, K. Kirsi American Bureau of Shipping
Treichler, R. John Raytheon Applied Signal Technology
Van de Walle, G. Chris University of California, Santa Barbara
Weitz, A. David Harvard University
Whittle, Peter University of Cambridge
Willner, Eli Alan University of Southern California
Zhang, Steve Yuzhuo Shenhua Group Corporation Ltd.