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Andreas Cangellaris is the dean of the College of Engineering and Professor of Electrical and Computer Engineering at the University of Illinois, Urbana Champaign (UIUC). Prior to joining UIUC he was on the faculty of Electrical and Computer Engineering at the University of Arizona, first as an assistant professor (1987 - 1992) and then as an associate professor (1992 - 1997). Before that, he was a senior research engineer in the Electronics Department of the General Motors research Laboratories in Warren, Michigan (1985 - 1987). Professor Cangellaris' research work has been in the area of applied and computational electromagnetics with emphasis on their application to electrical modeling and simulation of RF/microwave components and systems, high-speed digital interconnects at the board, package, and chip level, as well as the modeling and simulation of electromagnetic compatibility and electromagnetic interference. He has co-authored more than 150 refereed papers and three book chapters on topics related to computational electromagnetics and interconnects and package modeling and simulation. Over the past fourteen years, he has supervised the development of electromagnetic modeling methodologies and numerous computer modeling and simulation tools for high-speed/high-frequency signal integrity-driven applications, which have been transferred successfully to industry. Professor Cangellaris is a Fellow of the IEEE cited 'for contributions to methodologies and algorithms for modeling and simulation of the electromagnetic behavior of high-speed interconnections and electronic packages.' He is an active member of the IEEE Microwave Theory and Techniques Society, the IEEE Components Packaging and Manufacturing Technology Society, the IEEE Antennas and Propagation Society, and the IEEE Magnetics Society, serving as member of technical program committees for major conferences and symposia sponsored by these societies. He has served as associate editor for the IEEE Transactions on Antennas & Propagation, and he is currently serving as associate editor of the IEEE Transactions on Advanced Packaging and the IEEE Press Series on Electromagnetic Fields and Waves. He is the co-founder of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging.